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Technologies

 MICRO-VIA TECHNOLOGY

 Description:                   4 to 18 layers

 Base Material:               FR4 Prepreg or Laser drillable Prepreg

 Min. Board Thickness :   12 mils(4 layers)

 Min. Line/Spacing :         2/2 mils

 Min. Hole Size :              4 mils(laser)

 Surface Finish :              OSP(eg. Entek), ENIG,Selective ENIG,ENEPIG,Immersion Silver, Immersion Tin,ENIG thick Gold,

                                      Electrolytic Bondable soft Gold,etc

 Drilling Method:              CO2 Laser Drilling



 


FILLED VIAS MICRO-VIA

Description:                         6+N+6

Base Material                      FR4 Prepreg or Laser drillable Prepreg

Min. Board  Thickness :       12 mils (4 layers)

Min. Line  Width/Spacing :   2/2 mils

Min. Hole size :                   3 mils (Laser)

Surface Finish :                   OSP(eg. Entek), ENIG,Selective ENIG,ENEPIG,Immersion Silver, Immersion Tin,ENIG thick Gold, 

                                          Electrolytic Bondable soft Gold,etc

Drilling Method :                  CO2 Laser Drilling

Filled micro vias :                Filled by plating


 


RIGID FLEX PCBS    

Description:                     2 to 18 layers    

Base Material:                 FR4 or Polyimide base material    

Min. Board Thickness :     11.8 mils (Rigid), 4.7 mils (Flex)    

Min. Line/Spacing(Rigid) : 2/2 mils

Min. Line/Spacing(Flex) :  2.4/2.4 mils   

Min. Hole Size :               4.0 mils(machenical)    

Surface Finish :               OSP(eg. Entek), ENIG,Selective ENIG,ENEPIG,Immersion Silver, Immersion Tin,ENIG thick Gold,

                                      Electrolytic Bondable soft Gold,etc         

Special Features :           Flexibility, 3-D Packaging , Reduced Assembly Time and Cost, Higher Reliability, 

                                      Engineered Appearance, Reduced Weight


 


SEMI- FLEX PCBS    

Description:                     2 to 14 layers    

Base Material:                 FR4    

Flex region Thickness :     9.8+/-2mils    

Min. Line/Spacing(Rigid) : 2/2 mils

Min. Line/Spacing(Flex) :  2.4/2.4 mils   

Min. Hole Size :               4.0 mils(machenical)    

Surface Finish :               OSP(eg. Entek), ENIG,Selective ENIG,ENEPIG,Immersion Silver, Immersion Tin,ENIG thick Gold,

                                      Electrolytic Bondable soft Gold,etc         

Special Features :           90 degree,3-D Packaging , Reduced Assembly Time and Cost, Higher Reliability, 

                                      Engineered Appearance, Reduced Weight